Hot swappable computer card carrier

ABSTRACT

Embodiments are described including a device comprising a carrier frame. The device includes a first connector on a first side of the carrier frame, and the first connector connects to a host system when the carrier frame is inserted into the host system. The device includes a second connector on a second side of the carrier frame, where the second side of the carrier frame is perpendicular to the first side. The second connector electrically couples to the first connector and connects to an input/output (I/O) adapter card inserted into a third side of the carrier frame, where the third side perpendicular to the first side. Consequently, the device has a flat structure that receives an adapter card and reorients the electrical connection of the adapter card. The device includes external visual status indicators and a switch for hot-swapping of the adapter card carrier in a running host system.

TECHNICAL FIELD

The present invention relates generally to electronic computer cardsand, more particularly, to PCI Express (PCIe) I/O adapter cards and acard carrier adapted to receive PCIe cards in a 1U system chassis.

BACKGROUND

Data processing systems such as servers often include add-on adaptercards accessible from the back of the rack. These adapter cards, alsoreferred to as input/output (I/O) adapter cards or I/O cards, aretypically provided with standardized physical dimensions. These adaptercards may be communications adapter cards such as Fibre Channel adaptercards, Gigabit Ethernet (GbE) adapter cards, InfiniBand adapter cards,or graphic and video processing cards, to name a few. These adaptercards are often required to be serviced, replaced, or upgraded, meaningthat they need to be easy to access and easy to remove and replace.

I/O adapter cards such as PCIe card are generally provided in one or twosizes, i.e., a full-sized or half-sized card corresponding to a lengthof 12.283″ and 6.6″, respectively. In a typical blade serverenvironment, most hardware equipment is installed within 19-inch rackcabinets for easy installation and maintenance, with the 19-inch rackcabinet so referred to because the width of the cabinet that houses thehardware is 19 inches. The common computer rack can hold equipment witha total height of 42U, with 1U being 1.75″ (44.45 mm) in height. Asconsequence, the smallest equipment is housed in a 1U chassis, which isalso known as a “pizza box.” The 1U rack-mounted chassis is so callednot only because of its flat structure, but also because of the way itstop cover is removed.

As computer power increases, the need for I/O capability also increasesaccordingly. Unfortunately, the confined space of the 1U chassisseverely limits the addition of more I/O adapter cards. In particular,the height constraints placed on the 1U chassis requires that the cardscan only be placed horizontally in a typical chassis because the heightof the card (including the metal bracket) is generally greater than theinterior height of the chassis. While the horizontal card placementallows the I/O cards to be placed in the chassis, it is a non-optimalconfiguration considering the accessibility requirements of the 1Uchassis in the field. Consequently, the horizontal I/O cardconfiguration does not allow for hot-swap capability, and requires thefollowing procedure for removing a card: power down the server blade;remove server blade from rack cabinet; remove the top cover of serverblade; remove I/O card horizontally from connector.

Incorporation by Reference

Each patent, patent application, and/or publication mentioned in thisspecification is herein incorporated by reference in its entirety to thesame extent as if each individual patent, patent application, and/orpublication was specifically and individually indicated to beincorporated by reference.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded view of the card carrier including an adaptercard, under an embodiment.

FIG. 2 is a perspective view of the assembly or ensemble of the adaptercard and the card carrier, under an embodiment.

FIG. 3 is a top view of the assembly comprising the adapter card and thecard carrier, under an embodiment.

FIG. 4 shows insertion of the adapter card in the fully assembled cardcarrier and the securing of the adapter card with the retentionmechanism, under an embodiment.

FIG. 5 shows a front side or external view of the card carrier includingan adapter card, under an embodiment.

FIG. 6 shows a carrier housing for retaining two card carriers, under anembodiment.

FIG. 7 shows a perspective rear view of a system chassis with twoinstalled carrier housings, under an embodiment.

FIG. 8 shows the two mid-plane riser boards, under an embodiment.

FIG. 9 is a perspective view of a partial system chassis with ten cardcarriers, under an embodiment.

FIG. 10 is a side view of the system chassis with installed cardcarriers, under an embodiment.

FIG. 11 is a perspective view of a partial system chassis with twentyinstalled card carriers, under an embodiment.

DETAILED DESCRIPTION

Embodiments described herein provide a method and apparatus to increasethe number of installed I/O adapter cards in a 1U computing system. Anexample embodiment comprises an apparatus for providing electrical andmechanical coupling between an I/O adapter card and a host system. Theapparatus comprises a support bracket and a circuit board (e.g.,interconnect printed circuit board (PCB)) mounted to the supportbracket. The interconnect PCB includes an edge connector having aplurality of conductive fingers mounted on one outer side of the PCB anda connector having a rectangular shape with a receptacle side having aplurality of conductive contacts mounted on the other side of the PCB.Both the connector edge and the connector are flatly disposed on the PCBand are perpendicularly positioned relative to each other. The connectorand the connector edge are electrically coupled through conductivetraces formed on a surface of the PCB. A portion of the I/O adapter cardis inserted to the connector in a first direction that is parallel tothe edge connector. The edge connector is inserted to the host system ina second direction, which is perpendicular to the connector, hence theapparatus re-orients the insertion direction of the I/O adapter card.Additionally, the apparatus further comprises visual indicators adaptedfor showing the power and operational status of the I/O adapter card anda switch adapted for hot-swapping the I/O adapter card without shuttingdown the host system.

Another exemplary embodiment comprises a system for electricallycoupling a plurality of card carriers to a host system. The systemcomprises a carrier housing adapted to retain card carriers in acomputing system with space constraints. The card carrier is adapted toreceive an I/O adapter card and reorient its insertion direction. Thecarrier housing can securely retain two card carriers that aresubstantially horizontally positioned over one other. The carrierhousing comprises angled flanges at the lower sidewalls designed asmechanical coupling areas for securing the carrier housing to a systemchassis. The mechanical coupling of the carrier housing to the chassiscan be performed through welding or fastening using rivets and/orscrews. The system further comprises a riser board that includesconnectors on both sides for electrically coupling the plurality of cardcarriers to the host system.

Yet another embodiment comprises a method for installing I/O adaptercards within a system chassis having a computing motherboard. The methodcomprises providing a card carrier having a printed circuit board (PCB)flatly mounted on a carrier frame. The PCB includes a connector mountedalong one of its side for receiving an I/O adapter card and an edgeconnector disposed perpendicularly to the connector. The method furthercomprises providing a carrier housing that includes a front side, a backside and two parallel sidewalls. The sidewalls contain an angled flangeat the bottom for securing the carrier housing to a chassis. Thesidewalls also contain a guiding mechanism for easing the insertion ofthe card carrier into the carrier housing. Furthermore, the methodcomprises providing a riser board mounted vertically to the chassis. Theside facing exteriorly toward the carrier housing includes one or moreconnectors for receiving the card carriers; and the side facinginteriorly toward the computing motherboard may have a connector forreceiving a portion of the motherboard. Connectors on both sides of theriser board are electrically coupled. Additionally, the method furthercomprises installing the I/O adapter card into the card carrier thatincludes a retention arm for securing the I/O adapter card. Moreover,the method further comprises inserting the card carrier with theinstalled and secured I/O adapter card into the carrier housing usingthe guiding mechanism.

The card carrier of an embodiment enables the installation of multiplePCIe I/O adapter cards within a 1U, 4U and/or 5U computing system. Forexample, the card carrier configuration allows for installation of four(4) PCIe modules into a 1U system. The card carrier comprises a carrierframe configured as a staple-shaped support bracket for receiving andsecuring an interconnect printed circuit board (PCB). An edge connectorhaving a plurality of conductive fingers is mounted to the outer bottomside of the PCB, and a rectangular-shaped connector is mounted along theinner vertical side of the PCB. The edge connector and therectangular-shaped connecter are flatly positioned on the PCB and areoriented perpendicular to each other. The rectangular-shaped connectorcontains a receptacle having one or more terminal posts lining the innerwall of the receptacle. The receptacle is adapted to receive a portionof a PCIe I/O adapter card. The interconnect PCB serves to reorient theinsertion direction of the PCIe I/O adapter card. That is, the PCIe I/Oadapter card is moved along an insertion direction which isperpendicular to the insertion direction of the edge connector. Theelectrical contacts of the receptacle may be coupled to the edgeconnector through conductive traces that are disposed on the surfaceand/or within layers of the interconnect PCB. In one embodiment, theedge connector may be horizontally directly coupled to a systemmotherboard having a right-angled connector. In another embodiment, theedge connector may be indirectly coupled to the motherboard through areceiving connector mounted on a mid-plane riser board.

In the following description, numerous specific details are introducedto provide a thorough understanding of, and enabling description for,embodiments of the present invention. One skilled in the relevant art,however, will recognize that these embodiments can be practiced withoutone or more of the specific details, or with other components, systems,etc. In other instances, well-known structures or operations are notshown, or are not described in detail, to avoid obscuring aspects of thedisclosed embodiments.

Embodiments of the method and apparatus to increase the number ofinstalled I/O adapter cards described herein is provided in the contextof PCI-Express cards (PCIe cards). Thus, by way of example, the metalbracket, the connectors, and the add-in adapter cards described in thespecification are in compliance with the PCI-Express CardElectromechanical Specification and Base standardized by PCI-SIG. Theembodiments described here are not, however, limited to use only withPCIe cards and may be used with computer cards, adapter cards or I/Ocards of other types, configurations and/or combinations.

FIG. 1 is an exploded view of the card carrier 200 including a PCIe card210, under an embodiment. FIG. 2 is a perspective view of the assembly200 or ensemble of the adapter card and the card carrier, under anembodiment. The PCIe card 210 is shown to be at the center of anexploded card carrier 200. The card carrier 200 comprises a carrierframe 220. In an embodiment, the carrier frame 220 can be formed as onepiece using metal or plastic injection molding. A circuit boardcomprising a PCB 240 is mounted to the carrier frame 220, but theembodiment is not so limited. In an embodiment, an adhesive compositionsuch as high-performance glue may be used for the attachment of the PCB240 to the carrier frame 220. In another embodiment, the attachment ofthe PCB 240 to the carrier frame 220 can be secured with fasteners 248.The fasteners 248 may be preferably screws.

The PCB 240 of an embodiment includes an L-shaped structure. A connector244 is mounted along the inner side of the vertical line of the L-shapedPCB. The connector 244 on the PCB can be a right-angled connector thatis mounted to the PCB through through-holes or a straddle connector thatis mounted on the PCB by straddling both sides of the PCB. The connectorincludes a slot having a plurality of conductive contacts lining theinner edge of both slot walls. The slot is configured to receive an edgeconnector 212 of PCIe card 210. In one embodiment, connector 244 is aright-angled connector adapted to perform a x16 PCI Express link.However, the PCIe x16 slot configuration of the connector 244 can beother types of PCIe slot configuration (e.g., x2, x4, x8, x32).

The PCB 240 also includes an edge connector 242 positioned along theouter side of the horizontal line of the L-shaped structure. The edgeconnector 242 includes a plurality of conductive fingers disposed onboth sides having electrical and physical characteristics compliant withthe PCI-Express Base Specification Revision 2.0 standardized by PCI-SIG.

As connector 244 and edge connector 242 are disposed on the respectivevertical line and horizontal line of the L-shaped PCB 240, they arepositioned perpendicular relative to each other. In one embodiment, theconductive contacts of the connector 244 can be directly electricallycoupled to the conductive fingers of the edge 242 via conductive tracesdisposed on a surface (component layer or solder layer) of PCB 240. Inanother embodiment, the traces can be disposed on the surface and withinPCB 240, which may have one or more insulation layers and conductivelayers.

The PCB 240 may comprise an FR-4 material, but is not so limited. Thetraces may be laid out in a manner to ensure signal integrity, minimizeelectromagnetic interference (EMI), prevent cross talk and reduce signalskew. The layout guidelines of conductive traces for high data rates areknown to one of skill in the art. For example, IEEE 802.3ak providesguidelines of the trace layout for 10 Gbps Ethernet using an FR-4 typematerial. PCI Express specifies a maximum trace length of 20 inches,which dimension accommodates the embodiments described herein. However,for any reasons that signal integrity cannot be achieved in someembodiments of the present invention, a signal conditioner can beincluded to recondition the signals as they are transferred to the hostsystem. The signal conditioner of an embodiment, also referred to as aconditioner, is a conditioner integrated circuit (IC) 246, but is not solimited. The conditioner IC 246 can be positioned in the datapath orcoupling between the PCIe adapter card and the host system, and theconditioner IC 246 may be based on equalization and de-emphasistechniques. The equalization and de-emphasis techniques basicallyreverse the attenuation caused by the high data rate across ahigh-impedance PCB, thereby compensating for signal degradation. Theconditioner IC 246 may be required when signals must cross multipleconnectors or long backplanes.

Additionally, PCB 240, and thus the card carrier, comprises visualindicators 250 and a service button switch 252. The visual indicators250 and service button switch 252 may be mounted on the top end of theL-structure of PCB 240, adjacent to each other and facing away from thehost system. This configuration of the visual indicators 250 and servicebutton switch 252 places them at the front panel for ease of access.Visual indicators 250 can be light emitting diodes (LEDs) for indicatingthe power and operation status of the PCIe card 210, but the embodimentis not so limited. In one embodiment, service button switch 252 can be amomentary-contact push button switch. The number of LEDs, the number ofservice buttons, and the cited colors are merely specific examples ofsome embodiments of the card carrier and should not be limiting.

In an embodiment, visual indicators 250 comprise two bi-color LEDs. Abi-color LED is a single LED that can change color of the illuminatinglight, for example, from green to yellow and back, or from green to redand back. A first LED can be used as indicator for the power status; thecolor of the illuminating light is green when the power supplies of theadapter card are within normal operating ranges, and turns yellow whenone or more of the power supplies are outside the normal operatingranges signaling to a human operator than services may be required. Asecond LED can be used as a visual feedback to the operator. Theemitting light of the second LED is green in normal operation and turnsto a blinking yellow after the operator pushes the service button switch252 to signal to the host system or a downstream port of a PCIe switchfor an immediate hot-swap event. The second yellow LED stops blinkingafter a predetermined time period, e.g., five seconds, to indicate thatthe adapter card slot is now safe to be hot added and hot removed fromthe host system or from the downstream port. During the yellow blinkingperiod of the second LED, the operator can exit or cancel the hot-plugor hot-swap event by pressing service button switch 252 a second time.In this case, the blinking will stop and the second LED will resume itsgreen emitting light.

In an alternative embodiment, visual indicators 250 comprise threebi-color visual indicators. The first visual indicator and the secondvisual indicator may operate in a similar manner described above. Thethird visual indicator may be a uni-color or bi-color LED that indicatesthe physical layer and/or data link layer activities. For example, thethird LED is blinking green signaling that transaction packets are beingsuccessfully received. The blinking green light turns yellow whentransaction packets are being erroneously received in the physical, datalink, or transaction layer.

The carrier frame 220 can be a staple-shaped structure having a majorportion of the staple configured to support the L-shaped PCB 240. Theremaining portion of the staple-shaped structure contains an elevatedwall having a protrusion at each end. One protrusion end of the elevatedwall contains a number of openings 226 configured to provide access tovisual indicators 250 and service button switch 252. Another protrusionend 228 of the elevated wall may be used as an arrest for the metalbracket 214 of the PCIe card 210. Additionally, the elevated wallincludes an aperture 222 sufficiently large to provide access to themetal bracket 214 of the PCIe card 210. The metal bracket 214 containsin turn cutouts configured to provide access to I/O connectors (notshown) mounted on the PCIe card 210. The PCIe card can be furthersecured in place by a retention mechanism 232 that is coupled to thecarrier frame 220 through a carrier frame hinge 234. The retentionmechanism 232 comprises a retention latch mechanism for holding the PCIecard 210 in place once its edge connector has fully establishedelectrical contact with connector 244. The retention latch mechanismincludes a latch 236, a latch spring 280, and a screw 282, but is not solimited. The components of the retention latch mechanism are referred toherein collectively as the latch 236.

A status LED and service switch cover 224 may be provided for mechanicalprotection of the visual indicators 250 and the service button switch252. The cover 224 may be attached to the PCB 240 and the carrier frame220 using one or more fasteners 248. In one embodiment of the presentinvention, labels for the openings 226 may be directly put on the flatsurface of the elevated wall using spray painting, powder printing, orstencil printing. In another embodiment of the present invention, anexternal label 288 having matching cutouts with the openings 226 may beput over the openings.

FIG. 3 is a top view of the assembly comprising the PCIe card 210 andthe card carrier 200, under an embodiment. The PCIe card 210 is insertedin the card carrier 200. The metal bracket 214 of PCIe card 210 rests onthe protrusion end 228 of the carrier frame 220. The retention arm 232is closed along the outer side of the PCB 210.

FIG. 4 shows insertion of the adapter card 210 in the fully assembledcard carrier 200 and the securing of the adapter card with the retentionmechanism 232, under an embodiment. The edge connector 212 of the PCIecard 210 is inserted into the connector 244 located on the PCB 240. PCB240 is mounted to the carrier frame 220 using fasteners 248. Theconditioner IC 246 is mounted on the surface of the PCB 240 andpositioned between the connector 244 and edge connector 242. Theconditioner IC 246 ensures that signals transmitting from the PCIe card210 will be delivered to the host system with adequate eye-diagrammargins to conform to the PCI Express standard. The retention mechanismor arm 232 retains the PCIe card 210 in the inserted position. Thevisual indicators and the service button switch are hidden under thecover 224, which is mechanically connected to the PCB 240 and the cardcarrier 220 using fastener 248.

FIG. 5 shows a front side or external view of the card carrier includinga PCIe adapter card, under an embodiment. The contour 510 of the frontside of the card carrier has a protrusion 512 at the top and a recess514 at the bottom. The opening 222 configuration of the carrier frame220 as described above is sufficient to provide access to the bracket ofPCIe card. The bracket 520 generally has cutouts (shown as round circles522) adapted to accommodate I/O networking connectors mounted on thePCIe card. Label 288 is shown on the right having three round cutouts.The round cutout 252 on the right is for the button switch and islabeled “SERVICE”. The two round cutouts 250 in the middle are for thevisual indicator LEDs. Adjacent to the two round cutouts are thecorresponding labels for power status and for hot-swap service (with thelabel “!”).

The card carrier has been described in detail above. The card carrierprovides advantages of reorienting the insertion and removal directionof a PCIe card, so that the PCIe cards can be added or removed from ahost system from the access panel (e.g., back panel, front panel, etc.)without having to shut down the system power, physically remove thechassis and remove the cover. In order to install more than two stackedcard carriers in a 1U chassis, for example, a special carrier housing isrequired. Since the card carriers are not directly connected to themotherboard, additional connectors are required.

FIG. 6 shows a carrier housing 690 for retaining two card carriers 200,under an embodiment. The card carriers 200 are described above. Thecarrier housing of an embodiment is a rectangular-shaped box having afront side, a back side, and two parallel sidewalls. The front sideincludes an aperture sufficiently large to accept one or more cardcarriers. Each inner surface of the sidewalls may include one or moreguide rails running in parallel from the front side to the back side tomechanically support the card carriers. In an embodiment, the guiderails have a U-shaped structure, but are not so limited. In anotherembodiment, the guide rails are brackets that are directly formed fromthe sidewalls.

As described herein, the carrier housing including the card carrierscontained within, can be inserted or installed in a processing system.In particular, one or more carrier housings are inserted or installedinto a system chassis of a host processing system. The system chassiscan receive the carrier housings, and thus the adapter cards, in eitherof a horizontal configuration or a vertical configuration, both of whichare described in turn below.

FIG. 7 shows a perspective rear view of a system chassis 710 with twoinstalled carrier housings 790 and 792, under an embodiment. This systemchassis 710 is an example of a horizontal configuration, when referencedrelative to a bottom of the system chassis 710, but the embodiment isnot limited to only this configuration. The computing system 700comprises a chassis 710 having a front enclosure (not shown) and a rearenclosure 714, a motherboard 740 (partially shown), four card carriers772, 774, 776 and 778 that are retained in the two carrier housings 790and 792. In this example embodiment the carrier housings 790 and 792 areremoveably connected to the host system via openings or access regionsin the rear enclosure 714, but the embodiment is not limited to accessregions in the rear enclosure 714. The carrier housings and cardcarriers are each as describe above. Alternative embodiments can haveany number of carrier housings installed in a system chassis and, assuch, are not limited to two carrier housings containing two cardcarriers per housing.

The system of an embodiment includes a number of riser boards that eachincludes some number of connectors for connecting to card carriers. Asone example, the system 700 includes two mid-plane riser boards 750 and760 that electrically couple the PCIe cards to the motherboard 740. FIG.8 shows the two mid-plane riser boards 750 and 760, under an embodiment.Each mid-plane riser board is located or positioned in a middle regionof a system chassis and includes two PCIe connectors that connect to thecard carriers, as described above. In this example, a first mid-planeriser board includes two PCIe connectors (e.g., PCI-E #1, PCI-E #2), anda second mid-plane riser board includes two PCIe connectors (e.g., PCI-E#3, PCI-E #4), but the embodiment is not so limited. The mid-plane riserboards of this example receive the card carriers on a first side, andcouple or connect to the motherboard 740 of the host system on a secondside opposite the first side; in an alternative embodiment, however, themid-plane riser boards can receive the card carriers on a first side,and couple or connect to the motherboard of the host system on the firstside. In an embodiment, the mid-plane riser boards 750 and 760 aremounted to the chassis 710 using fasteners such as screws. The cardcarriers 772, 774, 776 and 778 are not fully inserted in the chassis710, and their covers protrude outside of the rear enclosure 714. Thisexample embodiment provides for relatively easy insertion and removal ofcard carriers, optical indicators that are more visible, and a hot-swapbutton switch that is easily accessed.

As another example, the system includes some number of back-plane riserboards (shown and described with reference to FIGS. 9, 10, and 11 below,in a vertical embodiment) that electrically couple the PCIe cards to themotherboard. Each back-plane riser board is located or positioned in anend region of a system chassis and is mounted to the system chassis; theend region of the system chassis is a region of the chassis opposite theaccess region that receives the carrier housing. Each back-plane riserboard includes some number of PCIe connectors that connect to the cardcarriers, as described above. For example, a first back-plane riserboard can include two PCIe connectors, and a second back-plane riserboard can include two PCIe connectors. The back-plane riser boards canreceive the card carriers on a first side, and couple or connect to themotherboard of the host system on a second side opposite the first side.In an alternative embodiment, the back-plane riser boards can receivethe card carriers on a first side, and couple or connect to themotherboard of the host system on the first side.

As described above, the system chassis can receive the carrier housings,and thus the adapter cards, in a vertical configuration, where thevertical configuration is referenced relative to a bottom of the systemchassis. FIG. 9 is a perspective view of a partial system chassis 910with ten card carriers 972, under an embodiment. This example embodimentincludes the carrier housings described above, but the carrier housingsare not shown for purposes of clarity. FIG. 10 is a side view of thesystem chassis 910 with installed card carriers 972, under anembodiment. The computing system comprises a chassis 910 (partiallyshown), a riser board 950, a motherboard 940, and ten (10) card carriers972 housed or retained in five carrier housings (not shown). Themotherboard 940 includes a number of straight connectors 1002 thatcouple or connect to the card carriers 972, and thus the adapter cards,as described above. The carrier housings and card carriers 972 are eachas describe above. Alternative embodiments can have any number ofcarrier housings installed in a system chassis, with each carrierhousing containing any number of card carriers, and, as such, are notlimited to two carrier housings containing two card carriers perhousing.

FIG. 11 is a perspective view of a partial system chassis 1110 withtwenty installed card carriers 972, under an embodiment. The computingsystem comprises a chassis 1110 (partially shown), a riser board 950, amotherboard 940, and twenty (20) card carriers 972 housed or retained inthe ten carrier housings (not shown). The carrier housings and cardcarriers 972 are each as describe above. Alternative embodiments canhave any number of carrier housings installed in a system chassis and,as such, are not limited to two carrier housings containing two cardcarriers per housing.

Regardless of the number of carrier housings and card carriers, thesystem includes some number of riser boards that electrically couple thePCIe cards to the motherboard. The views of this system depicted in thedrawings do not limit the example to mid-plane or back-plane riserboards, and the riser board depicted represents either of a mid-planeand a back-plane riser board. Each back-plane riser board includes somenumber of PCIe connectors that connect to the card carriers, asdescribed above. In this example, the riser boards receive the cardcarriers on a first side and couple or connect to the motherboard of thehost system on the first side. In an alternative embodiment, theback-plane riser boards can receive the card carriers on a first side,and couple or connect to the motherboard of the host system on a secondside opposite the first side, as described above.

The embodiments described herein include a device comprising: a carrierframe; a first connector on a first side of the carrier frame, the firstconnector connecting to a host system when the carrier frame is insertedinto the host system; and a second connector on a second side of thecarrier frame, the second side of the carrier frame perpendicular to thefirst side, the second connector electrically coupled to the firstconnector and connecting to an input/output (I/O) adapter card insertedinto a third side of the carrier frame, the third side perpendicular tothe first side.

The second connector of an embodiment is horizontally positioned so theI/O adapter card has a flat orientation relative to the carrier framewhen the I/O adapter card is connected to the second connector.

The carrier frame of an embodiment is inserted into the host systemalong a first direction, the first direction toward an interior portionof the host processing system, wherein the I/O adapter card is insertedinto the carrier frame along a second direction, the second directionoriented approximately normal to the first direction.

The device of an embodiment comprises a circuit board mounted to thecarrier frame, wherein the first connector and the second connector aremounted to the circuit board.

The circuit board of an embodiment includes a structure comprising atleast one of isolation layers and conductive layers.

The device of an embodiment comprises an ensemble module formed by thecircuit board mounted on the carrier frame and the I/O adapter cardsecured into the carrier frame, the ensemble module being slidinglyinserted and removed from the host system.

The device of an embodiment comprises a signal conditioner circuitcoupled between the first connector and the second connector.

The device of an embodiment comprises a circuit board mounted to thecarrier frame, wherein the signal conditioner circuit is anapplication-specific integrated circuit on the circuit board.

The device of an embodiment comprises at least one visual indicatorconfigured to indicate a power state and an operational status of theI/O adapter card.

The at least one visual indicator of an embodiment faces in a directionexternal to the host system.

The at least one visual indicator of an embodiment is one of a uni-colorlight emitting diode (LED), a bi-color LED, and a tri-color LED.

The device of an embodiment comprises a circuit board mounted to thecarrier frame, wherein the at least one visual indicator is carried onthe circuit board.

The device of an embodiment comprises a switch adapted for hot-swappingthe I/O adapter card, wherein hot-swapping comprises at least one ofinserting and removing the I/O adapter card while the host system isoperating.

The switch of an embodiment faces in a direction external to the hostsystem.

The third side of the carrier frame of an embodiment is coupled to thefirst side with a hinge, wherein the third side is placed in an openposition by rotating the third side around the hinge.

The device of an embodiment comprises a latch that secures the thirdside of the carrier frame in a closed position, wherein the closedposition secures the I/O adapter card in the carrier frame.

The I/O adapter card of an embodiment is compliant to a standard formfactor specified by PCI-SIG.

The embodiments described herein include a device comprising: a carrierframe; a circuit board connected to the carrier frame, the circuit boardincluding a first connector mounted to a first side and configured toform an electrical coupling with a host system when the carrier frame isinserted into the host system; and a second connector mounted to asecond side of the circuit board and coupled to the first connector,wherein the second side of the circuit board is perpendicular to thefirst side, wherein the second connector is configured to form anelectrical coupling with an adapter card inserted into a third side ofthe carrier frame, the third side perpendicular to the first side.

The embodiments described herein include a device comprising: a carrierframe; a circuit board connected to the carrier frame, the circuit boardincluding a first connector mounted to a first side, the first connectorforming an electrical coupling between the circuit board and a hostprocessing system when the carrier frame is inserted along a firstdirection into the host processing system, wherein the first directionis toward an interior portion of the host processing system; and asecond connector mounted to a second side of the circuit board, thesecond connector coupled to the first connector via a plurality oftraces of the circuit board, the second connector including a receptaclefor receiving an input/output (I/O) adapter card, the second connectorforming an electrical coupling between the I/O adapter card and thecircuit board when the I/O adapter card is inserted along a seconddirection into the carrier frame, wherein the second direction isoriented approximately normal to the first direction.

The embodiments described herein include a method comprising: forming anassembly by inserting an input/output (I/O) adapter card along a firstdirection into a carrier frame, wherein contacts of the I/O adapter cardconnect to a first connector of the carrier frame; and inserting theassembly into a host system along a second direction, wherein a secondconnector of the carrier frame connects to the host system and thesecond connector is coupled to the first connector, wherein the seconddirection is toward an interior portion of the host system and isoriented approximately normal to the first direction.

Forming the assembly of an embodiment comprises orienting the firstconnector horizontally so the I/O adapter card has a flat orientationrelative to the carrier frame when the I/O adapter card is connected tothe first connector.

The method of an embodiment comprises coupling the second connector tothe first connector using traces of a circuit board mounted to thecarrier frame.

The method of an embodiment comprises conditioning signals transferredbetween the first connector and the second connector.

The method of an embodiment comprises providing a visual indication ofat least one of a power state and an operational status of the I/Oadapter card.

The visual indication of an embodiment faces in a direction external tothe host system.

The inserting of the assembly of an embodiment into the host system isperformed while the host system is operating.

The method of an embodiment comprises removing the assembly from thehost system by sliding the assembly along the second direction.

The removing of the assembly of an embodiment from the host system isperformed while the host system is operating.

The embodiments described herein include a method comprising: forming anassembly by inserting an input/output (I/O) adapter card into a firstside of a carrier frame, wherein contacts of the I/O adapter cardconnect to a second connector of on a second side of the carrier frame,wherein the second side is approximately parallel to the first side,wherein a moveable portion of the first side secures the I/O adaptercard in the carrier frame; and inserting the assembly into a hostsystem, wherein a third connector on the third side of the carrier frameconnects to the host system, wherein the third side of the carrier frameis approximately perpendicular to the first side and the second side.

The embodiments described herein include a system comprising: a chassishaving an opening on a side; a riser board perpendicularly mounted tothe chassis and including a straight connector for receiving an adaptercard carrier; and a carrier housing having a rectangular shape includinga front side, a back side, and two parallel sidewalls, wherein the frontside includes an opening for accepting the adapter card carrier, whereineach of the two parallel sidewalls includes a flange for mechanicallycoupling the carrier housing to the chassis and a guide rail tohorizontally receive the adapter card carrier, wherein the openingreceives the carrier housing including the adapter card carrier and theadapter card carrier connects to the straight connector.

The riser board of an embodiment is a mid-plane riser board positionedin a middle region of the chassis.

The mid-plane riser board of an embodiment includes a second straightconnector, the second straight connector receiving a motherboard.

A first side of the mid-plane riser board of an embodiment includes thestraight connector.

The first side of the mid-plane riser board of an embodiment includesthe second straight connector.

A second side of the mid-plane riser board of an embodiment includes thesecond straight connector.

The riser board of an embodiment is a back-plane riser board positionedin an end region of the chassis, the end region opposite the opening.

A first side of the back-plane riser board of an embodiment includes thestraight connector.

The back-plane riser board of an embodiment includes a second straightconnector, the second straight connector receiving a motherboard.

The carrier housing of an embodiment has a horizontal orientationrelative to a bottom of the chassis when the adapter card carrier in thecarrier housing is connected to the straight connector.

The carrier housing of an embodiment has a vertical orientation relativeto a bottom of the chassis when the adapter card carrier in the carrierhousing is connected to the straight connector.

The riser board of an embodiment includes a third straight connector,wherein the third straight connector receives a second adapter cardcarrier.

The carrier housing of an embodiment accepts two adapter card carriers.

The riser board of an embodiment comprises a plurality of straightconnectors.

The system of an embodiment comprises a plurality of carrier housingsand a plurality of adapter card carriers, wherein each carrier housingaccepts two adapter card carriers, wherein the opening receives theplurality of carrier housings including the plurality of adapter cardcarriers, and the plurality of adapter card carriers couple to theplurality of straight connectors.

The adapter card carrier of an embodiment comprises: a carrier frame; afirst connector on a first side of the carrier frame, the firstconnector connecting to the straight connector when the carrier frame isinserted into the carrier housing; and a second connector on a secondside of the carrier frame, the second side of the carrier frameperpendicular to the first side, the second connector electricallycoupled to the first connector and connecting to an adapter cardinserted into a third side of the carrier frame, the third sideperpendicular to the first side.

The second connector of an embodiment is horizontally positioned so theadapter card has a flat orientation relative to the carrier frame whenthe adapter card is connected to the second connector.

The carrier frame of an embodiment is inserted into the carrier housingalong a first direction, the first direction toward an interior portionof the carrier housing, wherein the adapter card is inserted into thecarrier frame along a second direction, the second direction orientedapproximately normal to the first direction.

The system of an embodiment comprises a circuit board mounted to thecarrier frame, wherein the first connector and the second connector aremounted to the circuit board.

The adapter card carrier of an embodiment is formed by the circuit boardmounted on the carrier frame and the adapter card secured into thecarrier frame.

The system of an embodiment comprises a signal conditioner circuitcoupled between the first connector and the second connector.

The system of an embodiment comprises a circuit board mounted to thecarrier frame, wherein the signal conditioner circuit is anapplication-specific integrated circuit on the circuit board.

The system of an embodiment comprises at least one visual indicatorconfigured to indicate a power state and an operational status of theadapter card.

The at least one visual indicator of an embodiment faces in a directionexternal to the host system.

The at least one visual indicator of an embodiment is one of a uni-colorlight emitting diode (LED), a bi-color LED, and a tri-color LED.

The system of an embodiment comprises a circuit board mounted to thecarrier frame, wherein the at least one visual indicator is carried onthe circuit board.

The system of an embodiment comprises a switch adapted for hot-swappingthe adapter card, wherein hot-swapping comprises at least one ofinserting and removing the adapter card while the host system isoperating.

The switch of an embodiment faces in a direction external to the hostsystem.

The third side of the carrier frame of an embodiment is coupled to thefirst side with a hinge, wherein the third side is placed in an openposition by rotating the third side around the hinge.

The system of an embodiment comprises a latch that secures the thirdside of the carrier frame in a closed position, wherein the closedposition secures the adapter card in the carrier frame.

The adapter card of an embodiment is compliant to a standard form factorspecified by PCI-SIG.

The carrier housing of an embodiment is mounted in one of a 1U systemchassis, a 4U system chassis, and a 5U system chassis.

The embodiments described herein include a system comprising: a chassis;a riser board perpendicularly mounted to the chassis and including atleast one straight connector for receiving at least one adapter cardcarrier; and a carrier housing having a rectangular shape including afront side, a back side, and two parallel sidewalls, wherein the frontside includes an opening for accepting the adapter card carrier, whereineach of the two parallel sidewalls includes a flange disposed outwardlyat the bottom for mechanically coupling the carrier housing to thechassis, and a guide rail configured to horizontally receive the adaptercard carrier, wherein the back side includes an opening providing accessto the straight connector.

The adapter card carrier of an embodiment comprises: a carrier frame; afirst connector on a first side of the carrier frame, the firstconnector connecting to the at least one straight connector when thecarrier frame is inserted into the carrier housing; and a secondconnector on a second side of the carrier frame, the second side of thecarrier frame perpendicular to the first side, the second connectorelectrically coupled to the first connector and connecting to an adaptercard inserted into a third side of the carrier frame, the third sideperpendicular to the first side.

The system of an embodiment comprises a plurality of carrier housings,wherein each carrier housing includes a plurality of adapter cardcarriers, wherein each adapter card carrier includes at least oneadapter card that couples to the at least one straight connector.

The plurality of carrier housings of an embodiment has a horizontalorientation relative to the chassis.

The plurality of carrier housings of an embodiment has a verticalorientation relative to the chassis.

The embodiments described herein include a method comprising: forming anadapter card carrier by inserting an adapter card along a firstdirection into a carrier frame, wherein contacts of the adapter cardconnect to a first connector of the carrier frame; and inserting theadapter card carrier into a carrier housing of a host system along asecond direction, wherein a second connector of the carrier frameconnects to a straight connector of a riser board mounted to a chassisof the host system, wherein the second connector is coupled to the firstconnector, wherein the second direction is toward an interior portion ofthe host system and is oriented approximately normal to the firstdirection.

The method of an embodiment comprises forming the carrier housing tohave a rectangular shape including a front side, a back side, and twoparallel sidewalls, wherein the front side includes an opening foraccepting the adapter card carrier, wherein each of the two parallelsidewalls includes a flange for mechanically coupling the carrierhousing to the chassis and a guide rail to horizontally receive theadapter card carrier.

The method of an embodiment comprises forming the back side to includean opening providing access to the at least one straight connector ofthe riser board.

The method of an embodiment comprises forming the carrier housing toaccept two adapter card carriers positioned horizontally adjacent eachother.

The method of an embodiment comprises forming the first side of theriser board to include a second straight connector for receiving asecond adapter card carrier.

Forming the adapter card carrier of an embodiment comprises orientingthe first connector horizontally so the adapter card has a flatorientation relative to the carrier frame when the adapter card isconnected to the first connector.

The method of an embodiment comprises coupling the second connector tothe first connector using traces of a circuit board mounted to thecarrier frame.

The method of an embodiment comprises conditioning signals transferredbetween the first connector and the second connector.

The method of an embodiment comprises providing a visual indication ofat least one of a power state and an operational status of the adaptercard.

The visual indication of an embodiment faces in a direction external tothe host system.

The inserting of the adapter card carrier of an embodiment into the hostsystem is performed while the host system is operating.

The method of an embodiment comprises removing the adapter card carrierfrom the host system by sliding the adapter card carrier along thesecond direction.

The removing of the adapter card carrier of an embodiment from the hostsystem is performed while the host system is operating.

The method of an embodiment comprises inserting the carrier housing intoa chassis of the host system such that the second connector of thecarrier frame connects to the straight connector of the riser board.

The method of an embodiment comprises positioning the riser board so afirst side of the riser board faces the carrier housing and a secondside of riser board faces a motherboard of the host system.

The method of an embodiment comprises positioning the riser board so afirst side of the riser board faces the carrier housing and amotherboard of the host system.

The method of an embodiment comprises orienting the carrier housinghorizontally relative to a bottom of the chassis when the adapter cardcarrier in the carrier housing is connected to the straight connector.

The method of an embodiment comprises orienting the carrier housingvertically relative to a bottom of the chassis when the adapter cardcarrier in the carrier housing is connected to the straight connector.

The method of an embodiment comprises inserting a plurality of carrierhousings into the chassis, wherein each carrier housing includes aplurality of adapter card carriers, wherein each adapter card carrierincludes at least one adapter card that couples to at least one straightconnector of the riser board.

One or more components of the embodiments herein and/or a correspondingsystem or application to which the embodiments are coupled or connectedinclude and/or run under and/or in association with a processing system.The processing system includes any collection of processor-based devicesor computing devices operating together, or components of processingsystems or devices, as is known in the art. For example, the processingsystem can include one or more of a portable computer, portablecommunication device operating in a communication network, and/or anetwork server. The portable computer can be any of a number and/orcombination of devices selected from among personal computers, personaldigital assistants, portable computing devices, and portablecommunication devices, but is not so limited. The processing system caninclude components within a larger computer system.

The processing system of an embodiment includes at least one processorand at least one memory device or subsystem. The processing system canalso include or be coupled to at least one database. The term“processor” as generally used herein refers to any logic processingunit, such as one or more central processing units (CPUs), digitalsignal processors (DSPs), application-specific integrated circuits(ASIC), etc. The processor and memory can be monolithically integratedonto a single chip, distributed among a number of chips or components,and/or provided by some combination of algorithms. The methods describedherein can be implemented in one or more of software algorithm(s),programs, firmware, hardware, components, circuitry, in any combination.

The components of any system that includes the embodiments can belocated together or in separate locations. Communication paths couplethe components and include any medium for communicating or transferringfiles among the components. The communication paths include wirelessconnections, wired connections, and hybrid wireless/wired connections.The communication paths also include couplings or connections tonetworks including local area networks (LANs), metropolitan areanetworks (MANs), wide area networks (WANs), proprietary networks,interoffice or backend networks, and the Internet. Furthermore, thecommunication paths include removable fixed mediums like floppy disks,hard disk drives, and CD-ROM disks, as well as flash RAM, UniversalSerial Bus (USB) connections, RS-232 connections, telephone lines,buses, and electronic mail messages.

Aspects of the embodiments and corresponding systems and methodsdescribed herein may be implemented as functionality programmed into anyof a variety of circuitry, including programmable logic devices (PLDs),such as field programmable gate arrays (FPGAs), programmable array logic(PAL) devices, electrically programmable logic and memory devices andstandard cell-based devices, as well as application specific integratedcircuits (ASICs). Some other possibilities for implementing aspects ofthe embodiments and corresponding systems and methods include:microcontrollers with memory (such as electronically erasableprogrammable read only memory (EEPROM)), embedded microprocessors,firmware, software, etc. Furthermore, aspects of the embodiments andcorresponding systems and methods may be embodied in microprocessorshaving software-based circuit emulation, discrete logic (sequential andcombinatorial), custom devices, fuzzy (neural) logic, quantum devices,and hybrids of any of the above device types. Of course the underlyingdevice technologies may be provided in a variety of component types,e.g., metal-oxide semiconductor field-effect transistor (MOSFET)technologies like complementary metal-oxide semiconductor (CMOS),bipolar technologies like emitter-coupled logic (ECL), polymertechnologies (e.g., silicon-conjugated polymer and metal-conjugatedpolymer-metal structures), mixed analog and digital, etc.

It should be noted that any system, method, and/or other componentsdisclosed herein may be described using computer aided design tools andexpressed (or represented), as data and/or instructions embodied invarious computer-readable media, in terms of their behavioral, registertransfer, logic component, transistor, layout geometries, and/or othercharacteristics. Computer-readable media in which such formatted dataand/or instructions may be embodied include, but are not limited to,non-volatile storage media in various forms (e.g., optical, magnetic orsemiconductor storage media) and carrier waves that may be used totransfer such formatted data and/or instructions through wireless,optical, or wired signaling media or any combination thereof. Examplesof transfers of such formatted data and/or instructions by carrier wavesinclude, but are not limited to, transfers (uploads, downloads, e-mail,etc.) over the Internet and/or other computer networks via one or moredata transfer protocols (e.g., HTTP, FTP, SMTP, etc.). When receivedwithin a computer system via one or more computer-readable media, suchdata and/or instruction-based expressions of the above describedcomponents may be processed by a processing entity (e.g., one or moreprocessors) within the computer system in conjunction with execution ofone or more other computer programs.

Unless the context clearly requires otherwise, throughout thedescription and the claims, the words “comprise,” “comprising,” and thelike are to be construed in an inclusive sense as opposed to anexclusive or exhaustive sense; that is to say, in a sense of “including,but not limited to.” Words using the singular or plural number alsoinclude the plural or singular number respectively. Additionally, thewords “herein,” “hereunder,” “above,” “below,” and words of similarimport, when used in this application, refer to this application as awhole and not to any particular portions of this application. When theword “or” is used in reference to a list of two or more items, that wordcovers all of the following interpretations of the word: any of theitems in the list, all of the items in the list and any combination ofthe items in the list.

The above description of embodiments of the embodiments andcorresponding systems and methods is not intended to be exhaustive or tolimit the systems and methods to the precise forms disclosed. Whilespecific embodiments of, and examples for, the embodiments andcorresponding systems and methods are described herein for illustrativepurposes, various equivalent modifications are possible within the scopeof the systems and methods, as those skilled in the relevant art willrecognize. The teachings of the embodiments and corresponding systemsand methods provided herein can be applied to other systems and methods,not only for the systems and methods described above.

The elements and acts of the various embodiments described above can becombined to provide further embodiments. These and other changes can bemade to the embodiments and corresponding systems and methods in lightof the above detailed description.

In general, in the following claims, the terms used should not beconstrued to limit the embodiments and corresponding systems and methodsto the specific embodiments disclosed in the specification and theclaims, but should be construed to include all systems that operateunder the claims. Accordingly, the embodiments and corresponding systemsand methods is not limited by the disclosure, but instead the scope isto be determined entirely by the claims.

While certain aspects of the embodiments and corresponding systems andmethods are presented below in certain claim forms, the inventorscontemplate the various aspects of the embodiments and correspondingsystems and methods in any number of claim forms. Accordingly, theinventors reserve the right to add additional claims after filing theapplication to pursue such additional claim forms for other aspects ofthe embodiments and corresponding systems and methods.

1. A system comprising: a chassis having a chassis opening on a side; ariser board perpendicularly mounted to the chassis and including astraight connector for receiving an adapter card carrier; a carrierhousing having a rectangular shape including a front side, a back side,and two parallel sidewalls, wherein the front side includes an adaptercard opening for accepting the adapter card carrier, wherein each of thetwo parallel sidewalls includes a flange for mechanically coupling thecarrier housing to the chassis and a guide rail to horizontally receivethe adapter card carrier; wherein the chassis opening receives thecarrier housing including the adapter card carrier and a first connectorof the adapter card carrier connects to the straight connector through aconnector opening in the carrier housing; and wherein the adapter cardcarrier comprises a carrier frame, the first connector disposed on afirst side of the carrier frame, a second connector disposed on a secondside of the carrier frame, the second side of the carrier frameperpendicular to the first side, the second connector electricallycoupled to the first connector, the second connector configured toconnect to an adapter card inserted into the adapter card carrier, thecarrier frame further comprising a third side that is rotatably coupledto the first side of the carrier frame, the third side configured torotate to an open position and facilitate insertion of an adapter cardinto the adapter card carrier.
 2. The system of claim 1, wherein theriser board is a mid-plane riser board positioned in a middle region ofthe chassis.
 3. The system of claim 2, wherein the mid-plane riser boardincludes a second straight connector, the second straight connectorreceiving a motherboard.
 4. The system of claim 3, wherein a first sideof the mid-plane riser board includes the straight connector.
 5. Thesystem of claim 4, wherein the first side of the mid-plane riser boardincludes the second straight connector.
 6. The system of claim 4,wherein a second side of the mid-plane riser board includes the secondstraight connector.
 7. The system of claim 1, wherein the secondconnector is horizontally positioned so the adapter card has a flatorientation relative to the carrier frame when the adapter card isconnected to the second connector.
 8. The system of claim 1, wherein thecarrier frame is inserted into the carrier housing along a firstdirection, the first direction toward an interior portion of the carrierhousing, wherein the adapter card is inserted into the carrier framealong a second direction, the second direction oriented approximatelynormal to the first direction.
 9. The system of claim 1, comprising acircuit board mounted to the carrier frame, wherein the first connectorand the second connector are mounted to the circuit board.
 10. Thesystem of claim 9, wherein the adapter card carrier is formed by thecircuit board mounted on the carrier frame and the adapter card securedinto the carrier frame.
 11. The system of claim 1, comprising a signalconditioner circuit coupled between the first connector and the secondconnector.
 12. The system of claim 11, comprising a circuit boardmounted to the carrier frame, wherein the signal conditioner circuit isan application-specific integrated circuit on the circuit board.
 13. Thesystem of claim 1, comprising at least one visual indicator configuredto indicate a power state and an operational status of the adapter card.14. The system of claim 13, wherein the at least one visual indicatorfaces in a direction external to the host system.
 15. The system ofclaim 13, wherein the at least one visual indicator is one of auni-color light emitting diode (LED), a bi-color LED, and a tri-colorLED.
 16. The system of claim 13, comprising a circuit board mounted tothe carrier frame, wherein the at least one visual indicator is carriedon the circuit board.
 17. The system of claim 1, comprising a switchadapted for hot-swapping the adapter card, wherein hot-swappingcomprises at least one of inserting and removing the adapter card whilethe host system is operating.
 18. The system of claim 17, wherein theswitch faces in a direction external to the host system.
 19. The systemof claim 1, wherein the adapter card is compliant to a standard formfactor specified by PCI-SIG.
 20. The system of claim 1, wherein thecarrier housing is mounted in one of a 1U system chassis, a 4U systemchassis, and a 5U system chassis.
 21. The system of claim 1, wherein theriser board is a back-plane riser board positioned in an end region ofthe chassis, the end region opposite the chassis opening.
 22. The systemof claim 21, wherein a first side of the back-plane riser board includesthe straight connector.
 23. The system of claim 22, wherein theback-plane riser board includes a second straight connector, the secondstraight connector receiving a motherboard.
 24. The system of claim 1,wherein the carrier housing has a horizontal orientation relative to abottom of the chassis when the adapter card carrier in the carrierhousing is connected to the straight connector.
 25. The system of claim1, wherein the carrier housing has a vertical orientation relative to abottom of the chassis when the adapter card carrier in the carrierhousing is connected to the straight connector.
 26. The system of claim1, wherein the riser board includes a third straight connector, whereinthe third straight connector receives a second adapter card carrier. 27.The system of claim 26, wherein the carrier housing accepts two adaptercard carriers.
 28. The system of claim 1, wherein the riser boardcomprises a plurality of straight connectors.
 29. The system of claim28, comprising a plurality of carrier housings and a plurality ofadapter card carriers, wherein each carrier housing accepts two adaptercard carriers, wherein the chassis opening receives the plurality ofcarrier housings including the plurality of adapter card carriers, andthe plurality of adapter card carriers couple to the plurality ofstraight connectors.
 30. The system of claim 1, further comprising alatch that secures the third side of the carrier frame in a closedposition, wherein the closed position secures the adapter card withinthe adapter card carrier.
 31. A system comprising: a chassis; an adaptercard carrier comprising a carrier frame with a first connector disposedon a first side of the carrier frame and a second connector disposed ona second side of the carrier frame, the second side of the carrier frameperpendicular to the first side, the second connector electricallycoupled to the first connector, the second connector configured toconnect to an adapter card inserted into the adapter card carrier, thecarrier frame further comprising a third side that is rotatably coupledto the first side of the carrier frame, the third side configured torotate to an open position and facilitate insertion of an adapter cardinto the adapter card carrier; a riser board perpendicularly mounted tothe chassis and including at least one straight connector for receivingat least one adapter card carrier; and a carrier housing having arectangular shape including a front side, a back side, and two parallelsidewalls, wherein the front side includes an opening for accepting theadapter card carrier, wherein each of the two parallel sidewallsincludes a flange disposed outwardly at the bottom for mechanicallycoupling the carrier housing to the chassis, and a guide rail configuredto horizontally receive the adapter card carrier, wherein the back sideincludes an opening providing access to the straight connector.
 32. Thesystem of claim 31, comprising a plurality of carrier housings, whereineach carrier housing includes a plurality of adapter card carriers,wherein each adapter card carrier includes at least one adapter cardthat couples to the at least one straight connector.
 33. The system ofclaim 32, wherein the plurality of carrier housings has a horizontalorientation relative to the chassis.
 34. The system of claim 32, whereinthe plurality of carrier housings has a vertical orientation relative tothe chassis.